Precision Inspection & Semiconductors
Wafer and packaging visual inspection, PCB inspection, and precision dimensional measurement
Imaging Challenge
- Small defect sizes demand high resolution and optical magnification.
- High-speed production lines require clear imaging during rapid motion.
- Challenges of low-light and high-reflectance scenarios; sensitive to dynamic range and signal-to-noise ratio.
The MAX high-resolution area sensor and SENSE large-area model cover static re-inspection and online inspection. Combined with external trigger synchronization and uncompressed 1 2-bit output, they help equipment improve cycle time while maintaining consistent defect detection.
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Large Panel and LED Screen Inspection
Full-screen LED display inspection, large-panel defect re-verification, single-shot large-format imaging
Imaging Challenge
- Large field of view causes geometric consistency issues in stitched imagery.
- Frame rate limit detected. High-resolution real-time transmission required.
- High data bandwidth demands high stability for interfaces and transmission.
The SENSE series large-format models cover a wider field of view in a single shot. Combined with high-bandwidth interfaces like SFP and CoaxPress, they reduce the need for stitching and motion axes, boosting overall screen inspection efficiency.
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High-Speed 3D Detection & Automation
3D Camera App, High-Speed Motion Capture, Robotic Vision Guidance
Imaging Challenge
- Fast-moving objects cause motion blur; high-speed acquisition and precise triggering are required.
- Multi-station, multi-camera deployment with consistent parameters and simplified operations.
- Large data volumes require high-bandwidth interfaces.
The SPRINT series is designed for high-speed acquisition. With CameraLink, SFP, and CoaxPress interfaces, it meets the cycle time requirements of 3D inspection and high-speed automated production lines.
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Electron Microscopy & Material Testing
SEM Imaging, Metallography and Fracture Analysis, Surface Defect and Composition Distribution Observation
Imaging Challenge
- Weak electron microscope output signals require large pixels and low noise to ensure grayscale fidelity.
- Wide range of material detail scales require high resolution and dynamic range.
- Requires stable imaging and sufficient data bandwidth for long-term observation and acquisition.
The SENSE series features 3265 / 6502 / 6504 large-pixel sensors and supports CameraLink, SFP, and CoaxPress 12 interfaces to deliver smooth grayscale transitions and stable high-speed data transmission in electron microscopy imaging and material inspection applications.
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Special Imaging and Electro-Optical Pod
Special detection in near-infrared bands, low-light observation, pod-based search and ranging
Imaging Challenge
- Image quality degrades in low-light and special wavelength conditions.
- Outdoor and vehicle deployments demand high reliability and low power consumption.
- Multispectral integrated solutions for search, tracking, and ranging
MAX 2518 is designed for high-sensitivity specialized detection. The electro-optical pod integrates infrared, visible light, and laser rangefinding capabilities, with customizable structural and algorithmic support available per project.
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Requirement Communication
Selection Recommendation
Mockup Testing
Bulk Delivery
Technical Support